/ COSMOS I-1201 / Canon ANELVA COSMOS I-1201 (PVD, for solder bump) / /

/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_01/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_02/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_03/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_04/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_05/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_06/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_07/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_08/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_09/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_10/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_11/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_12
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_01
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_02
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_03
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_04
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_05
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_06
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_07
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_08
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_09
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_10
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_11
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_12

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Delivery Ship within 5 DAYS after payment received

Warranty No warranty

Condition OEM: Used Working, Untested

1 available

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  • Process
    -
  • Wafer size
    12inch(300mm)
  • Delivery Service
    Economy service (more than 10 business days)
  • Payment method
    PayPal Bank Transfer
Item description:
No. Item HxWxL (cm)
1 Main Body 2000x1800x1900
2 Load/Unload Unit 2000x1300x1850
3 System Rack 2300x900x550
4 LCD Monitor Rack 1270x680x400
5 Controller Rack 2100x1400x1350
6 AC Power Rack 2000x1200x600
7 Cryo Rack
1. ANELVA CRYOPMP COMPRESSOR UNIT-875CA(2 units) Label Only
1800x700x650
8 Chiller 1450x700x650
9 DC Rack 2700x1050x550
10 RF Rack 2000x1050x550
11 Main UPS Power Supply 900x900x550
12 Dry Pump Rack
1. EBARA DRY PUMP AA10N (Upper Stage) LAbel Only
2. EBARA DRY PUMP AA30 (Lower Stage) Label Only
1500x1200x1320
13 Cryo He Hose 1300x1100x600
14 Process CH-A (SLA-ICP) 1900x1000x1150
15 Process CH-B (Cooling+Gate Bulb 3 Sets) 1100x1100x1100
16 Process CH-C (Unused Main PVD Specifications) 1900x1000x1150
17 Process Process CH-D (Cu Process) 1900x1000x1150
18 Process CH-E (Ti Proces) 1900x1000x1150
19 Process CH-F (Heat Process) 1200x1100x1100
20 For Maintenance Crane-1 Cover-1 2400x1100
21 For Maintenance Crane-2 (foundation)
1. Hitac Heavy Machinery Design CADDY ARM HDS120-RL-VY (Special) Label only
1800x1100x1100
22 Cover-2 1100x1100x1100
23,24,25 1. CH relay BOX 1022-41205C REV.01
2. CH relay BOX 1022-33862C REV.02
3. CH relay BOX 1022-39070C REV.03
4. ULVAC gas analyzer Qulee CGM-052
5. Denki Kogyo MATCHING CONTROL UNIT STC-1S
6. Denki Kogyo MATCHING NETWORK ST-1S
7. APC Smart-UPS 1000 LCD 100V SMT1000J
8. APC Smart-UPS 1000VA USB & Serial 100V SUA1000J
9. OMRON liquid level sensor EE-SPX613 (19 peices)
10. ULVAC Pirani Vacuum Gauge WPB-10-034
11. OMRON Photo Microsensor EE-SX674
12. Copal Eletronics Pressure Gauge PG-35-102R-NVC
900x1100x1100
26 Cable-1 1400x1200x1200
27 Cable-1

1. Canon Anelva Model: Cosmos 300PVD
2. Voltage: 200VAC, 3Phase/200VAC, 3Phase
3. Wiring Config. 3Wire+Ground, Freq. : 50Hz/60Hz
4. Main Breaker: 175A/225A, Interrupt Current: 10.0A/10.0A
Item spec:
CANON ANELVA IC7300 (I 1201), end model (Vintage), PVD SystemChambersDegasCoolSLA-ICPCollimated CO (ESC) (2) STD-PVD (ESC)2002 vintage.AbstractA film forming apparatus is provided with a shutter containing section connected to a processing chamber via an opening and containing a shutter in a retracted state into a gas discharge chamber, and a shield member for covering the gas discharge opening of the gas discharge chamber and formed around the opening of the shutter containing section. The shield member is provided with a first gas discharge path communicating with the gas discharge opening of the gas discharge chamber and located at a predetermined height between the opening of the shutter containing section and a film forming means.
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