/ COSMOS I-1201 / Canon ANELVA COSMOS I-1201 (PVD, for solder bump) / /

/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_01/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_02/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_03/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_04/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_05/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_06/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_07/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_08/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_09/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_10/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_11/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_12
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_01
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_02
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_03
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_04
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_05
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_06
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_07
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_08
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_09
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_10
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_11
/COSMOS I-1201/Canon ANELVA COSMOS I-1201 (PVD, for solder bump)//_12

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Condition OEM: Used Working, Untested

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  • Wafer size
    12inch(300mm)
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    Economy service (more than 10 business days)
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Item description:
CANON ANELVA IC7300 (I 1201), end model (Vintage), PVD SystemChambersDegasCoolSLA-ICPCollimated CO (ESC) (2) STD-PVD (ESC)2002 vintage.AbstractA film forming apparatus is provided with a shutter containing section connected to a processing chamber via an opening and containing a shutter in a retracted state into a gas discharge chamber, and a shield member for covering the gas discharge opening of the gas discharge chamber and formed around the opening of the shutter containing section. The shield member is provided with a first gas discharge path communicating with the gas discharge opening of the gas discharge chamber and located at a predetermined height between the opening of the shutter containing section and a film forming means.
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